Solution Proposal from Mitutoyo
Electronic Devices: Can You Evaluate Fine Patterns?
-Non-contact 3D measurement system Hyper Quick Vision WLI series
Demand for electronic devices and semiconductor packages is rising, driven by IoT, automotive CASE, and 5G communications, leading to a growing need for dimensional measurement to ensure enhanced reliability.
In 3D packaging technology, which is gaining attention alongside advancements in semiconductor thinning, high-precision dimensional measurement is crucial for evaluating mounter positioning accuracy and RDL misalignment.
The contactless 3D measurement system, the Hyper Quick Vision WLI series, employs white light interferometry technology to accurately measure wiring and small-diameter vias that are becoming increasingly thin in 3D applications.
Minimizing Operator Errors from Setup Changes
Challenges:
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Evaluation of next-generation fine patterns is beyond the capabilities of the current machine.
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The need for automatic dimension measurement and fine shape evaluation using a single machine to support mass production and increased production efficiency.
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Manual measurement leads to errors, as the same pattern is repeated and evaluation points are incorrectly identified.
Unable to Measure Fine Patterns with the Existing Machine
The machine also enables measurement of high aspect ratio L&S patterns, small-diameter vias, and the rise of thin film deposition with precision.
Seeking to Transition the Inspection Method from Manual to Automatic
"Dual head mechanism" for image measurement and white interferometer
Measuring Machines without a Coordinate System Struggle to Accurately Locate Measurement Points
Easy aiming of the measurement point "Dual head mechanism"
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