Solution Proposal from Mitutoyo

Ceramic Device Evaluation

Ceramic substrates are widely utilized in industrial applications due to their exceptional thermal conductivity, heat dissipation, and insulation properties.

However, during manufacturing processes such as HTCC, LTCC, and MLCC, shrinkage of these substrates from stacking and firing green sheets can result in misalignment of wiring patterns, posing a significant quality risk.

Mitutoyo's Vision Measuring Machine offers a robust solution for quality control, ensuring that defective products are detected early and do not proceed to later production stages.

Challenges in Measuring Ceramic Substrates

Warpage caused during firing or lamination at high temperatures, misalignment due to elongation and contraction, and defects from pattern printing are common issues in manufacturing.

Have defects occurred due to failure to perform as designed?

Below are some common issues that can be solved with Mitutoyo's Quick Vision Pro:

Issue 1: It takes too long to measure all arrays for high reliability.

Issue 2: It takes too long to inspect warped ceramic laminated boards and to focus on their cavities.
 

Issue 3: The yield is deteriorating due to miniaturization and multilayering of MLCCs.

　Solution 1: Achieve full array inspection by shortening the measurement time.

Issue 1: It takes too long to measure all arrays for high reliability.

Unlike conventional CNC vision machines, Mitutoyo's Quick Vision Pro CNC vision machine is capable of non-stop measurement while moving.
 
Non-stop measurement is possible, enabling inspection of all arrays while meeting strict takt times.
  
Inspection of all arrays helps reduce the cost of not transferring defective products to the next process and improves reliability by strengthening quality control.

　Solution 2: Eliminate time to focus using TAF (tracking autofocus)

Issue 2: It takes too long to inspect warped ceramic laminated boards and to focus on their cavities.

"Quick Vision Pro" features the tracking autofocus function (TAF), which allows the focus to follow the measured object, greatly reducing measurement time. In addition, slight stoppages from detection errors caused by warpage are reduced, freeing up inspectors to concentrate on other tasks.

　Solution 3: Improve yield by strengthening your in-process inspection

Issue 3: The yield is deteriorating due to miniaturization and multilayering of MLCCs.

The high-throughput Quick Vision Pro can incorporate spot inspections in each process without reducing the overall cycle time.

This helps improve yield by preventing defective products from advancing to the next process.

Need help solving a measurement problem? Contact us anytime!

Related Solutions and Applications

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