Solution Proposal from Mitutoyo

Semiconductor Parts Evaluation

Demand for electronic devices and semiconductor packages is rising, driven by advancements in IoT, automotive CASE, and 5G communications. This growth is accompanied by an increasing need for precise dimensional measurement to ensure reliability.

In 3D packaging technology, which is gaining attention alongside semiconductor thinning advancements, high-precision dimensional measurements are crucial for accurate mounter positioning and assessing RDL lamination deviations.

To meet these needs, we introduce the most suitable models tailored for each application.

Previous Process Applications

• A/N MARK (SEMI standard): Width, position, dot diameter and depth

• Parts for CVD equipment: Shower head nozzle holes (Inner diameter, roundness, and position)

• Parts for CVD equipment: Ceramic heater, silicon ring (Flatness, profile analysis, surface roughness)

• Parts for CMP equipment: Polishing pad (Groove width, groove depth, groove pitch, and surface roughness)

• Parts for etching equipment: Electrostatic chuck, silicon ring (Flatness, cross-sectional shape, surface roughness)

Post-Process Applications

• Lead frame (Width, pitch, height, twist, etc.)

• Wire loop height

• Parts for CVD equipment: Ceramic heater, silicon ring (Flatness, profile analysis, surface roughness)

• Lead width, pitch, height variance, clearance

• Solder ball height, diameter, pitch

• Package board coplanarity

Need help solving a measurement problem? Contact us anytime!

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